Director of Packaging Materials Development
LUMILEDS MALAYSIA SDN BHD
No. 3 Lintang Bayan Lepas 8,
Kawasan Perindustrian Bayan Lepas,
Fasa 4, Mukim 12
11900 Penang. Malaysia
Title : The future of optoelectronics packaging in high data rates application
Abstract
The Internet-of-Things (IoT) continues to drive the growth of semiconductor industry. According to the 2012 IEEE 802.3 Bandwidth Assessment Report, core network traffic is doubling every 18 months, computing and server I/O bandwidth is doubling every 4 months, and 400G Ethernet standards are needed as soon as the 100G standards are completed. The ever increasing data rates over the internet are straining the infrastructure. External data is limited by how fast and how far can move through cables and interconnects that link switches, routers, storage subsystems, etc. Parallel multiple high speed channels are used to deliver data at 100 Gbps with limited distance. Complex signal processing techniques coupled with extensive copper cables bulk to move high speed data rates to a distance greater than 300m is impractical. Therefore, industry is moving towards extending reach of optical signal from station-to-station, rack-to-rack, board-to-board and even chip-to-chip. Optical interconnect is looking at extending reach at component level, and silicon photonics is tasked to minimize the loss of electric signal. The packaging solution in FPGA industry is faced with the challenges to enable high density and high bandwidth component with next generation low loss materials as well as integration of optical waveguide in organic packages. This paper will describe the evolution of high density packaging technologies and the proposed integration approach of optoelectronics to enable high data rates application.
Biography:TY Hin is Manager of Packaging Technology R&D at Altera Corporation. He has authored and co-authored over 20 technical papers in the area of electronic packaging. He has numerous industry experiences in developing new technologies for high density organic packaging such as coreless substrate, copper pillar, stacked-die packages, wafer level chip scale package (WLCSP), copper wire package, thermal interface materials (TIM), etc. His current research interests are ultra-low cost packaging for wearables application as well as optoelectronic packaging for optical waveguide integration. TY received his Bachelor degree in Universiti Teknologi Malaysia and Doctorate degree in Loughborough University, UK. He is also leading a CREST Research Grant project on new material research for TIM application. In addition, he serves as Secretary for IEEE-CPMT Malaysia chapter for 2015.
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